Every design has different needs. In order to simplify the ordering process Sunstone has published our set of standard multi-layer constructions for FR-4 designs. These stackups are designed to offer balance, adequate resin for filling and stocked materials that should not have an impact on your lead time.
Some designs may not be an ideal candidate for these stackups and may require some adjustment.
*Plating Target is minimum of 0.0008" in the hole with approximately 0.001" - 0.0014" on the surface. Design can influence the plated thickness, generally thinner on dense copper areas (i.e. ground planes) and thicker on isolated copper features (traces or pads).
Dielectric constant for material (core and prepreg) is 4.5 (+/- 0.10)
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