Every design has different needs. In order to simplify the ordering process Sunstone has published our set of standard multi-layer constructions for FR-4 designs. These stackups are designed to offer balance, adequate resin for filling and stocked materials that should not have an impact on your lead time.
Some designs may not be an ideal candidate for these stackups and may require some adjustment.
*Plating Target is minimum of 0.0008" in the hole with approximately 0.001" - 0.0014" on the surface. Design can influence the plated thickness, generally thinner on dense copper areas (i.e. ground planes) and thicker on isolated copper features (traces or pads).
Dielectric constant for material (core and prepreg) is 4.5 (+/- 0.10)
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Sunstone Circuits® is the established leader in providing innovative and reliable printed circuit board (PCB) solutions for the electronic design industry. Since 1972, Sunstone Circuits has delivered high quality, on-time PCBs and is committed to improving the prototyping through production processes for the design engineer from quote to delivery. With white-glove support, Sunstone Circuits provides unparalleled customer service and leads the industry with over 99% on-time delivery.