Every design has different needs. In order to simplify the ordering process Sunstone has published our set of standard multi-layer constructions for FR-4 designs. These stackups are designed to offer balance, adequate resin for filling and stocked materials that should not have an impact on your lead time.
Some designs may not be an ideal candidate for these stackups and may require some adjustment.
*Plating Target is minimum of 0.0008" in the hole with approximately 0.001" - 0.0014" on the surface. Design can influence the plated thickness, generally thinner on dense copper areas (i.e. ground planes) and thicker on isolated copper features (traces or pads).
Dielectric constant for material (core and prepreg) is 4.5 (+/- 0.10)
Sign-up for SPECIAL OFFERS & unlock discounts:
American Standard Circuits (ASC) and Sunstone Circuits have joined forces to become the ultimate PCB solution provider with over 50 years of combined industry experience. ASC excels in producing Ultra HDI, rigid, metal-backed/core, RF/microwave, flex, and rigid-flex PCBs for diverse industries, while Sunstone Circuits is known for quick-turn, high-quality PCBs and exceptional customer support. This strategic alliance combines ASC's certifications and expertise with Sunstone's commitment to excellence, setting a new standard in PCB manufacturing. Together, we provide full scale solutions for engineers, from design to prototype to large-scale production.