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RF/Microwave PCB

We offer advanced RF microwave PCBs that use high frequency and heat sink technologies. We have extensive experience and technical expertise in the manufacturing of time critical, high technology RF circuit boards. We work closely with our worldwide customers to deliver prototype-to-high volume manufacturing of RF microwave PCBs.

Some of the suppliers of laminate / dielectric materials we utilize are:  Nelco, Rogers, Isola, & Taconic. We  manufacture high frequency PCBs with metal heat sinks for the telecommunication and aerospace industries. The heat sinks and RF Microwave PCBs are typically connected thermally and electrically. The metal heat sinks help with thermal dissipation and grounding of circuits. ASC uses commercially available pre-bonded and post-bonded materials for our RF microwave PCBs. Pre-bonded laminates are typically supplied by Rogers, Isola, or Taconic. Post-bonding is done via commercially available sheet film adhesive materials, ASC’s patented sheet film adhesives or sweat solder.

  • Blind & Buried Vias
  • Conductive & Non Conductive Via Fill
  • Castellations
  • Wire bondable surface finishes
  • Laser cut vias and routing
  • Pre-bonded and post-bonded metal backed circuit boards
  • Plated through-hole capability metal carrier to PTFE
  • Cavity structures
  • HDI
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ASC has state-of-the-art process control systems and certifications including AS9100 Rev D, ISO 9001:2015, ISO 13485, IATF16949:2016, MIL-PRF-31032 and MIL-PRF-50884 along with rigorous SPC controls, automated optical inspection, metallographic cross-section and electrical test facilities.