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RF metal backed

We manufacture exceptional RF metal core PCBs (MCPCB) and can produce Single-sided, Double-sided and Multilayer circuit boards with metal cladding/MCPCB for improved thermal management and grounding. We manufacture high frequency PCBs with metal heat sinks for the telecommunication and aerospace industries. The heat sinks and PCBs are typically connected thermally and electrically. Our RF metal core PCBs have  metal heat sinks that help with thermal dissipation and grounding of circuits.

We use commercially available pre-bonded and post-bonded materials for our multi-layer, single, and double sided boards. Pre-bonded laminates are typically supplied by Rogers or Taconic. Post-bonding is done via commercially available sheet film adhesive materials and our metal core PCBs use patented sheet film adhesives or sweat solder.

Applications for these PCBs are RF Power Amplifiers, Splitters & Combiners, Complex Filters, RF Power Distribution, and more. Some of the suppliers of laminate / dielectric materials we utilize are: Isola, Nelco, Rogers & Taconic. Metals include Aluminum, Copper, and Brass Composites. If you are looking for multi-layer, single, and/or double sided RF metal core PCBs, look no further!

  • Pre-bonded and post-bonded materials
  • Thermally and electrically conductive and non-conductive proprietary adhesive bonded laminates
  • Plated through-hole capability metal carrier to PTFE
  • In-house plating and precision machining for finished assemblies
  • Pre-bonded and post-bonded materials
  • Thermally and electrically conductive and non-conductive proprietary and commercially available adhesive bonded laminates
  • Plated through-hole capability metal carrier to PTFE
  • Single, Double-sided & Multilayer
  • Precision pocket machining
  • Heat sink technology
  • Any type of wire bondable finishes
  • In-house plating and precision machining for finished assemblies
  • Pre-bonded to Post-bonded assembly conversion

We make PCBs with unique aluminum composite materials to match the coefficient of thermal expansion (CTE) for various heat generating devices. These materials can match the CTE of ceramics, transistor packages and PCBs. This gives greater flexibility in designs to use lightweight materials and meet challenging environmental requirements.

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ASC has state-of-the-art process control systems and certifications including AS9100 Rev D, ISO 9001:2015, ISO 13485, IATF16949:2016, MIL-PRF-31032 and MIL-PRF-50884 along with rigorous SPC controls, automated optical inspection, metallographic cross-section and electrical test facilities.