PCBexpress^® Quickturn Construction Detail

The following stackups are the standard constructions for PCBexpress^® quickturn products and the 1 oz thickness Full Feature Product.

	Thickness (inches)	Tolerance (+/-)
Layer 1	0.0017	0.0004	0.5 oz foil plated to approximate*
Laminate Core	0.0580	0.0005	Dielectric Constant 4.5 (+/- 0.10)
Layer 2	0.0017	0.0004	0.5 oz foil plated to approximate*
Overall:	0.061	0.006
* Plating target is minimum of 0.0008" in the hole with approximately 0.001" on the surface. Design can influenece the plated thickness, generally thinner on Ground planes and thicker on signals.

	Thickness (inches)	Tolerance (+/-)
Layer 1	0.0017	0.0004	0.5 oz foil plated to approximate*
Bonding ply (1 x 7628, 2 x 1080)	0.0119	0.0010	Dielectric Constant 4.5 (+/- 0.10)
Layer 2	0.0014	0.0004	1 oz. foil
Laminate Core	0.0280	0.0025	Dielectric Constant 4.5 (+/- 0.10)
Layer 3	0.0014	0.0004	1 oz. foil
Bonding ply (1 x 7628, 2 x 1080)	0.0119	0.0010	Dielectric Constant 4.5 (+/- 0.10)
Layer 4	0.0017	0.0004	0.5 oz foil plated to approximate*
Overall:	0.0580	0.0061
* Plating target is minimum of 0.0008" in the hole with approximately 0.001" on the surface. Design can influenece the plated thickness, generally thinner on Ground planes and thicker on signals.

	Thickness (inches)	Tolerance (+/-)
Layer 1	0.0017	0.0004	0.5 oz foil plated to approximate*
Bonding ply (1 x 2116, 2 x 1080)	0.0064	0.0007	Dielectric Constant 4.5 (+/- 0.10)
Layer 2	0.0014	0.0004	1.0 oz foil thickness
Laminate Core	0.014	0.002	Dielectric Constant 4.5 (+/- 0.10)
Layer 3	0.0014	0.0004	1 oz. foil thickness
Bonding ply (2 x 2116)	0.0084	0.0008	Dielectric Constant 4.5 (+/- 0.10)
Layer 4	0.0014	0.0004	1 oz. foil thickness
Laminate Core	0.014	0.002	Dielectric Constant 4.5 (+/- 0.10)
Layer 5	0.0014	0.0004	1.0 oz foil thickness
Bonding ply (1 x 2116, 2 x 1080)	0.0064	0.0007	Dielectric Constant 4.5 (+/- 0.10)
Layer 6	0.0017	0.0004	0.5 oz foil plated to approximate*
Overall:	0.0582	0.0086
* Plating target is minimum of 0.0008" in the hole with approximately 0.001" on the surface. Design can influenece the plated thickness, generally thinner on Ground planes and thicker on signals.