PCBexpress Quickturn Circuit Board Construction Details

PCBexpress Quickturn multilayer printed circuit boards offer you the best value for up to 100 pieces per order. Available in 2- to 6-layer PCB construction, PCBexpress Quickturn multilayer printed circuit boards are manufactured in our U.S. facility.

Multilayer Printed Circuit Board Stackups

The following multilayer printed circuit board stackups are the standard constructions for PCBexpress quickturn products and the 1 oz thickness Full Feature Product.

Standard 2 Layer PCB Construction (0.062")

  Thickness
(inches) 		Tolerance
(+/-) 		 
Layer 1 0.0017 0.0004 0.5 oz foil plated to approximate*
Laminate Core 0.0580 0.0005 Dielectric Constant 4.5 (+/- 0.10)
Layer 2 0.0017 0.0004 0.5 oz foil plated to approximate*
Overall: 0.061 0.006
* Plating target is minimum of 0.0008" in the hole with approximately 0.001" on the surface. Design can influenece the plated thickness, generally thinner on Ground planes and thicker on signals.

Standard 4 Layer PCB Construction (0.062")

  Thickness
(inches) 		Tolerance
(+/-) 		 
Layer 1 0.0017 0.0004 0.5 oz foil plated to approximate*
Bonding ply
(1 x 7628, 2 x 1080) 		0.0119 0.0010 Dielectric Constant 4.5 (+/- 0.10)
Layer 2 0.0014 0.0004 1 oz. foil
Laminate Core 0.0280 0.0025 Dielectric Constant 4.5 (+/- 0.10)
Layer 3 0.0014 0.0004 1 oz. foil
Bonding ply
(1 x 7628, 2 x 1080) 		0.0119 0.0010 Dielectric Constant 4.5 (+/- 0.10)
Layer 4 0.0017 0.0004 0.5 oz foil plated to approximate*
Overall: 0.0580 0.0061
* Plating target is minimum of 0.0008" in the hole with approximately 0.001" on the surface. Design can influenece the plated thickness, generally thinner on Ground planes and thicker on signals.

Standard 6 Layer PCB Construction (0.062")

  Thickness
(inches) 		Tolerance
(+/-) 		 
Layer 1 0.0017 0.0004 0.5 oz foil plated to approximate*
Bonding ply
(1 x 2116, 1 x 1080) 		0.0064 0.0007 Dielectric Constant 4.5 (+/- 0.10)
Layer 2 0.0014 0.0004 1.0 oz foil thickness
Laminate Core 0.014 0.002 Dielectric Constant 4.5 (+/- 0.10)
Layer 3 0.0014 0.0004 1 oz. foil thickness
Bonding ply
(2 x 2116) 		0.0084 0.0008 Dielectric Constant 4.5 (+/- 0.10)
Layer 4 0.0014 0.0004 1 oz. foil thickness
Laminate Core 0.014 0.002 Dielectric Constant 4.5 (+/- 0.10)
Layer 5 0.0014 0.0004 1.0 oz foil thickness
Bonding ply
(1 x 2116, 1 x 1080) 		0.0064 0.0007 Dielectric Constant 4.5 (+/- 0.10)
Layer 6 0.0017 0.0004 0.5 oz foil plated to approximate*
Overall: 0.0582 0.0086
* Plating target is minimum of 0.0008" in the hole with approximately 0.001" on the surface. Design can influenece the plated thickness, generally thinner on Ground planes and thicker on signals.