Our goal is to make this the easiest online tutorial for learning how printed circuit boards are manufactured. Scroll down to view the steps in the circuit board manufacturing process.

Step#1 Film Generation:


Generated from your design files, we create an exact film representation of your design. We will create one film per layer.

Step#2 Shear Raw Material:


Industry standard 0.059" thick, copper clad, two sides. Panels will be sheared to accommodate many boards.

Step#3 Drill Holes:


Using NC machines and carbide drills.

Step#4 Electroless Copper:


Apply thin copper deposit in hole barrels.

Step#5 Apply Image:


Apply photosensitive dryfilm (plate resist) to panel. Use light source and film to expose panel. Develop selected areas from panel.

Step#6 Pattern Plate:


Electrochemical process to build copper in the holes and on the trace area. Apply tin to surface.

Step#7 Strip & Etch:


Remove dryfilm, then etch exposed copper. The tin protects the copper circuitry from being etched.

Step#8 Solder mask:


Apply solder mask area to entire board with the exception of solder pads.

Step#9 Solder coat:


Apply solder to pads by immersing into tank of solder. Hot air knives level the solder when removed from the tank.

Step#10 Nomenclature:


Apply white letter marking using screen printing process.

Step#11 Fabrication:


Route the perimeter of the board using NC equipment.

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